The MT6290 delivers LTE data rates as high as 150Mbit/s downlink and 50Mbit/s uplink. The chip implements FDD and TDD (Frequency Division Duplex and Time Division Duplex) modes of LTE for broad compatibility with mobile operator networks worldwide. In addition to LTE, the MT6290 also supports DC-HSPA+, W-CDMA, TD-SCDMA, EDGE and GSM/GPRS radio technologies.
The supporting RF chip in the platform is called MT6169 which supports up to 8 primary RF inputs (3 high bands, 2 mid bands, 3 low bands), plus another 8 RF inputs for diversity gains. The RF chip supports more than 30 3GPP bands and is configurable to meet the RF band needs of mobile operators globally.
“We are pleased to unveil our first LTE modem platform at the CES show and seek to create a global market of mainstream LTE devices in collaboration with our mobile operator partners.” said Cheng-Te Chuang, Head of Wireless Communications Technology Businesses Unit and Vice President of MediaTek. “The MT6290 is fully-compatible with the presently-available 3G mobile SOCs from MediaTek and our next-generation SOCs with LTE integration will be sampling throughout 2014.”
Mohit Bhushan, VP/GM of MediaTek Corporate Marketing, USA, said: “MediaTek has shared its LTE plans with all US operators, and the response has been terrific. We are now preparing to certify the MT6290 platform with all US operators followed by the commercialization of MT6290-enabled data devices within 2014.”
The MT6290 reference design has already been delivered to MediaTek’s early-adopter OEM partners and the first commercial devices are expected in Q2 2014.