Mitsubishi Electric Corporation has recently announced the development of a new electro-absorption modulator laser diode (EML) chip that is capable of transmitting data at a speed of up to 200Gbps. This represents a significant improvement over the company’s previous EML chip, which had a transmission speed of 100Gbps. The development of the new chip was made possible through a hybrid waveguide structure that combines a buried heterostructure laser diode and a high-mesa waveguide electro absorption modulator.
High-Speed and Multiplexing Capabilities
The new EML chip boasts improved operational speed, high extinction ratio, and high output power thanks to its unique hybrid waveguide structure. Its high-speed operation makes it an ideal choice for optical transceivers used in data centers, which need to keep up with the growing demand for cloud computing and video distribution services. In addition, the chip’s support for coarse wavelength division multiplexing (CWDM) of four wavelengths allows for the multiplexing of optical signals of different wavelengths in a single fiber, reducing the number of fibers required.
With the new EML chip’s 4-wavelength support for CWDM, transmission speeds of up to 800Gbps using four chips or 1.6Tbps using eight chips are possible. This offers a significant improvement over the previous EML chip’s capabilities, which could only achieve 400Gbps using four chips.
Future Plans and Environmental Commitment
Mitsubishi Electric plans to showcase the new EML chip at the Optical Fiber Communication Conference and Exhibition (OFC) 2023 in San Diego, USA, from March 5-9. The company plans to begin mass production of the chip in 2024 and is also considering expanding support to eight wavelengths for compatibility with additional transmission methods.
The new EML chip from Mitsubishi Electric is compliant with the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS) directive 2011/65/EU and (EU) 2015/863, demonstrating the company’s commitment to environmental awareness.
Mitsubishi Electric’s development of a new electro-absorption modulator laser diode chip with high-speed and multiplexing capabilities is a significant breakthrough in the field of optical communications. Its unique hybrid waveguide structure and support for coarse wavelength division multiplexing of four wavelengths make it an ideal choice for data centers looking to keep up with the growing demand for cloud computing and video distribution services. The company’s commitment to environmental awareness is also commendable, with the new EML chip being compliant with the RoHS directive.